DATAPAQ temperature profiling systems include high-accuracy industrial-strength data loggers, analysis software, thermal barriers, and thermocouples. DATAPAQ AutoPaq is a customized thermal profiling system for temperature monitoring of paint, adhesive and sealant cure processes used in the automotive assembly market. Offering up to 20 channels of measurement in a single system, Datapaq AutoPaq is the perfect tool for performing detailed cure validation of new installations or optimizing existing lines for new models. With real time RF capability, the system may also be the preferred choice for routine live monitoring of paint operations as part of standard QA procedures. Range of silicone-free barriers providing safe and contamination-free options to suit single and multi-run operations Oven Insight Professional software written for the automotive paint engineer to perform process QA or full validation quickly, efficiently and accurately
Germany
The automotive industry standard in thermal profiling Multiple oven tests possible before returning to PC Process Pass/Fail at oven exit Up to 16 measurement locations in a single run Hard wired real-time data analysis from batch ovens Fully customizable and easy-to-use Insight analysis software Wide range of thermal barriers (silicone-free) & thermocouples to suit your process needs DATAPAQ temperature profiling systems comprise high-accuracy industrial-strength data loggers, thermocouples, thermal barriers, and analysis software.
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The automotive industry standard in thermal profiling of paint cure processes Silicone-free technology Multiple oven tests possible before returning to PC Process Pass/Fail at oven exit Up to 16 measurement locations in a single run Hard wired real-time data analysis from batch ovens Fully customizable and easy-to-use Insight analysis software Wide range of thermal barriers & thermocouples to suit your process needs
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DATAPAQ Oven Tracker profilers based on the compact DATAPAQ DP5 data logger are designed for short and medium duration coating cure processes and optimized for low ovens. The portfolio includes high-accuracy DATA LOGGERS with six or 12 measurement channels, protective THERMAL BARRIERS, the Datapaq Insight ANALYSIS SOFTWARE, and type K, N, or T THERMOCOUPLES. The DATAPAQ DP5 data loggers have been designed to ensure minimum cost of use. They can store up to 10 profile runs before being returned to the PC for download and detailed analysis. This enables rapid verification of a number of ovens with no wasted time. The powerful built-in & harsh-environment radio transmitter provides real time data from within the process opening a ‘window’ into the process, speeding up fault finding and process optimizations. The loggers can be recharged from flat to usable in just five minutes. A full charge via high-speed USB takes only 90 minutes and can provide 20 profile runs.
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The DATAPAQ DP5 data loggers combine speed of readings, high accuracy and high resolution all in one versatile unit. They are used in short duration low height processes in electronics and coating curing applications. The DP5 data logger features include: • Temperature range: -100°C to 1370°C/-328°F to 2498°F (Type K thermocouples) • USB and Bluetooth communication • Fast sampling capability and large memory • Available in four height and width options and up to 12 thermocouple channels • User-replaceable NiMH battery and charging from any USB power socket ensure the Datapaq DP5 is always ready for use • Start/stop buttons and time or temperature trigger for improved user control
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