ENSINGER SINTIMID GMBH

Starting with the base polymer TECASINT 4011, TECASINT 4021 with 15% graphite has been developed. Thanks to the improved friction and wear properties, TECASINT 4011 is particularly suitable for tribological applications. It is also suitable for dry applications since the material is self lubricating.

Compared with the other TECASINT materials the TECASINT 4100 series exhibits extremely high thermal stability, extremely low moisture absorption and high mechanical rigidity. This is accompanied by a very high oxidative stability and increased resistance to chemicals. TECASINT 4111 has a very high thermal stability (HDT/A=470°C). Rigidity and modulus are significantly increased vis a vis conventional polyimides in a temperature range up to 400 °C. The material has minimal thermal and electrical conductivity. The plastic is highly pure with low outgassing in accordance with ESA regulation ECSS Q 70 20.

TECASINT 4121 is based on the base polymer TECASINT 4111, plus 15% graphite. The material is particularly suitable for tribological applications thanks to its improved friction and wear behaviour. Thanks to its self lubricating property, TECASINT 4121 is well suited to dry applications.

The unfilled grade TECASINT 5111 natural is based on the high-performance plastic polyimide, which is characterised by its very good thermal stability with low thermal expansion. Polyimides are non-melting polymers with a service temperature of 300 °C, which is considerably higher than that of PEEK or PPS. In addition, TECASINT 5111 natural has a high creep resistance. These properties makes PI plastic ideal for applications where high temperature resistance is required, such as in the aerospace industry. TECASINT 5111 natural has good chemical resistance, especially to light acids and many organic solvents. In combination with the very good electrical insulating properties of the PI material, TECASINT 5111 natural is also perfectly suited for applications in the semiconductor industry, electrical engineering or mechanical engineering. Moreover, the polyimide material has good mechanical properties, good wear resistance and is also resistant to high-energy radiation.

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 340°C, while the maximum service temperature may be – for a short time – up to 300 °C.

TECASINT 5501 ESD light-brown is an electrically modified polyimide based on the further development of TECASINT 5111. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 10 E6-10 E8 Ohm. The ESD material is therefore ideally suited for applications where electrostatic dissipation is to be ensured. Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance. The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics or in nuclear and vacuum technology.

TECASINT 6012 is an unfilled grade for direct forming parts with max. strength and elongation. Lowest modulus and thermal conductivity and optimum electrical properties.

TECASINT 6022 is a graphite filled grade for direct forming parts with enhanced wear resistance and improved long term thermal stability. Tribological grade for bearings, washer, sliding elements

TECASINT 6032 is a highly filled grade for direct forming parts with low coefficient of thermal expansion and high creep resistance.

TECASINT 6062 is a highly filled grade for direct forming parts with low static friction. For lubricated and unlubricated tribological applications