Edge grinding

Depending on the customers’ orders, the crystals are being ground on the outside diameter of a diamond peripheral sawing disk. We have got three centre grinders with a total monthly capacity 2000 kg. Maximum ground diameter – Ф200 mm. Accuracy 0.03 mm. Surface roughness - Ra ˂ 0.25.

The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.

Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25