FOTHERSHIELD

Fothershield offer EMI shielding products and thermal interface materials to help the electronics engineer comply with the electromagnetic compliance regulations.For board level design, we can offer board level shielding cans to isolate individual components. Thermally conductive gap fillers dissipate heat away to heat sinks and conformal coatings protect the board from chemical, dust, salt spray or other environmental contaminants. Enclosures often need shielding to seal any gaps. A range of conductive gaskets including conductive fabric over foam, conductive elastomers, knitted wire mesh and metal spring gaskets are available, as well as copper and aluminium metal foil tapes to seal gaps or even seams in shielded rooms. Conductive coatings such as carbon, nickel, copper silver or silver coatings can be applied to plastic enclosure for shielding. Available in epoxy, acrylic and water based urethanes. Conductive pens are used for conductive traces or repairs. 3D printing in ABS-ESD7 is an excellent material used to produce a variety of parts in areas where static build up, such as in ATEX (explosive atmospheres) industries or in electronic manufacturing industries is to be avoided. Other material, such as graphite, nylon 12, flexible polypropylenes can also be 3D printed. Aluminium honeycomb vents and EMI shielded windows are used in enclosures where airflow or visibility are required.

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  • Electronic components
  • EMI Shielding
  • Electromagnetic compatibility
  • Conductive coatings
  • Conductive Gaskets

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  • 51 – 100
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