The Aluminum oxide (Al2o3) 96% ceramic plates are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. Alumina ceramic substrate / plate specification: > 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. > The thickness of ceramic plate ranges from 0.25 to 1.0mm Can be made according to your requirements.
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Aluminium Oxide, Al2O3 is a major engineering material. It offers a combination of good mechanical properties and electrical properties leading to a wide range of applications. Alumina can be produced in a range of purities with additives designed to enhance properties. A wide variety of ceramic processing methods can be applied including machining or net shape forming to produce a wide variety of sizes and shapes of component. In addition it can be readily joined to metals or other ceramics using metallising and brazing techniques. Alumina based ceramics are by far the largest range of advanced ceramics made by INNOVACERA. Due to the important combination of properties, we have thoroughly researched the behaviour and characteristics of our Alumina products to give you the best possible component. Typical Alumina characteristics include: Good strength and stiffness Good hardness and wear resistance Good corrosion resistance Good thermal stability Excellent dielectric properties
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Innovacera uses its deep ceramics expertise and process capabilities to manufacture ceramics with precisely controlled porosity. Porous ceramics are often used for chemical filtration and fluid separation. The range of Innovacera porous ceramics is made from aluminum oxide and silicon carbide. The strong, uniform porous ceramic has 40-50% open porosity with a tortuous pore structure and is available in pore sizes ranging from 1 to 100 microns. Three Main Application of Porous Ceramic: Vacuum Chuck, like scribing machine vacuum chuck, silicon wafer vacuum chuck. Adsorption platform. Suspension platform. Especially, they are widely used for the semiconductor industry, like LED wafer processing. The micro-porous ceramic working disk is a special tool for adsorption and bearing in various semiconductor wafer production processes, and is applied to processes such as thinning, dicing, cleaning, and handling.
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Alumina, also known as aluminum oxide (Al2O3), is the most mature and commonly used technical ceramics. With excellent electrical insulation properties together with high hardness and good wear resistance but relatively low strength and fracture toughness. Alumina content ranging from 80% to more than 99% according to different application. It's widely used in automotive, petro-chemical, fluid contro, material transfer, industry, electrical and electronic, semiconductor,etc... - High Temperature Ability - Abrasion Resistant - Wear Resistance - Chemical Resistance - Electrical Insulator - Corrosion resistant - High compressive strength - High mechanical Strength - Resists strong acid and alkali attack at high temperatures - Excellent electrical insulation properties - Decent thermal conductivity
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DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
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