Lapping

The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.

Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25

Full square 100х100 from Ф 135 mmPseudo-square 100х100 from Ф125 mm Pseudo-square 125х125 from Ф150 mm