China
Service Provider
China
PCB reverse engineering is the process of analyzing a circuit board to identify the components used, their function and layout. This can be done for a variety of reasons, such as to improve the design or to create a clone of the board. More info: https://reversepcb.com/services/pcb-reverse-engineering/
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Contact us for all IC unlock service. E.g, MCU, DSP, ARM reverse engineering, IC programming, disassemble bin files. More info: https://reversepcb.com/services/ic-unlock/
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We offer a wide range of PCB Design Services to suit the needs of our customers. From basic to advanced, we’ve got you covered. Our Full electronic design capabilities: PCB stack-up design Micro bga stencil design Schematic capture and analysic PCB Thermal design PCB layout RF design High speed board design Digital board design DFM/DFA validation EMI checking Database Construction and Verification Signal integrity service Routing and impedance control More info: https://reversepcb.com/services/pcb-design/
Request for a quoteWell Done Technology specializes in PCB design services, PCB reverse engineering, IC unlocking, and PCB cloning. Our team of over 40 senior engineers has been working for over 13 years. We serve clients worldwide, including North America and Europe Southeast Asia. More info: https: //reversepcb.com/
Service Provider
B205, Block 7, Phase 2, D & J Innovation Park, 73 Bulan Road, Longgang, Shenzhen, China
518100 Shenzhen - China
China
Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid
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Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times
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Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service
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PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.
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