Description

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Adaption board for approx. 40 different QFP-, SOP-, SSOP-, SDIP-casings: QFP- 0.80 mm Pitch: 44, 56, 64, 72, 80, 94, 100, 120-Pin QFP- 0.85 mm Pitch: 48, 54, 56, 64, 68, 80, 100-Pin QFP- 0.50 mm Pitch: 48, 64, 72, 80, 100, 120, 144, 160-Pin SOP- 1.27 mm Pitch: max. 44-Pin in 225, 300, 375, 450, 525, 600 mil. SOP- 1.00 mm Pitch: max. 36-Pin in 225, 300, 375 mil. SSOP- 0.80 mm Pitch: max. 42-Pin in 300, 450 mil. SSOP- 0.65 mm Pitch: max. 30-Pin in 225, 300 mil. SDIP- 1.778 mm Raster: max. 64-Pin in 300, 400, 500, 600, 750 mil. Size 100 x 160 mm

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