ROTH ELEKTRONIK GMBH

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 1.27 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 1. 00 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.80 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.65 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0. 635 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.50 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0. 40 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with staggered square and rectangle pads Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with square-pads in parallel order Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 17 self-adhesive strips with potential strips Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm