Packaging- metal - Import export

DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)

Plant-based biodegradable labels With plastic doing so much harm to our environment – more and more brands are looking at biodegradable packaging to minimise damage.