Packaging development - Import export

The robust BGA package and extended temperature range make these modules the ideal choice for high-volume industrial applications and mobile data services. A subset of the interfaces are pin-to-pin compatible with its predecessor, allowing easy upgrade. FAMILY CONCEPT The xE864 family features a common 30x30 mm footprint, low profile BGA package. This allows developers and integrators to easily drop in different variants of the xE864 family with little design and integration time and effort. KEY FEATURES Easy migration from previous Telit versions and short time-to-market BGA package enables the design of compact applications, with reduced cost compared to board-to-board connector mounting Easy firmware update by transmitting only a small delta file