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The AD813ARZ-14 is a high-speed, low-power video amplifier module from Analog Devices Inc. It is designed for use in video applications such as video switching, video distribution, video signal processing, and video signal conditioning. It features a wide bandwidth of 100 MHz, a low current supply of 4.5 mA, and a slew rate of 250V/µs. It is available in a 14-SOIC package and operates over a temperature range of -40°C to 85°C.

A box build assembly includes all the other assembly work involved in an electro-mechanical assembly, other than the manufacturing of the PCBA. A box build assembly is also sometimes called “turnkey assembly”. Moreover, it consists of an outside box/enclosure, inner PCBA, interface keypad, wire-harness, connectors, displays, keyboards, etc. Assemble all components and parts to be a full and completed product that can be directly sent to the customer for selling is just box-build assembly. In addition, it covers such a wide range of items that requires the final assembly manufacturer has very strong engineering capability, skilled workers, a clean environment, good supply-chain management, good components, and parts coordinate ability for final assembly manufacturing.

Designed with CYW88335 / CYW89335 chip and conforms to IEEE 802.11ac and BT4.1 standard, it is a single channel dual-frequency WiFi combo solution.

Designed with TI WL1837Q chip, which supports 2×2 MIMO WiFi, Bluetooth and BLE. It provides high data throughput and extended coverage.

WF-M37I-FY2 module is designed with TI WL1837 chip, which supports 2×2 MIMO WiFi, Bluetooth and BLE. It provides high data throughput and extended coverage.

WF-MM01-1 module is designed with MTK7601 chip, which supports USB communication interface and meets the IEEE802.11n and IEEE802.11 b/g standards. The wireless transmission rate can reach 150Mbps and support WFA, WPA/WPA2, WPS2.0 and WAPI. Its excellent performance with low power consumption can adapt to different working conditions.

WF-MR89-1 module is designed with RTL8189 chip, which supports SDIO communication interface and meets the IEEE802.11n and IEEE802.11b/g standards. The wireless transmission rate can reach 150Mbps and support WFA, WPA/WPA2, WPS2.0 and WAPI. Its excellent performance with low power consumption can adapt to different working conditions.

WF-M07I-1 module is designed with TI WL1807I chip, which supports 2×2 MIMO WiFi, Bluetooth and BLE. It provides high data throughput and extended coverage.

The BT-MQ37-1 module is designed with Qualcomm QCC300x chip, a stereo flash memory programmable solution which is fully certified by Bluetooth 5.0 certification and having a high cost performance. It supports single MIC cVc echo cancellation and hands-free noise reduction technology. With the use of the AT commands to control the module through the serial port, customers can develop the Bluetooth functions and applications effectively.

BT-MC56 / BT-MC55 series are designed with Qualcomm CSR classic BC05MM+ external flash solution and built-in with Bluetooth protocol stack, which are compatible with Bluetooth 3.0, and supports various protocols such as HFP, HSP, A2DP, AVRCP, SPP and PBAP. With the use of the AT commands to control the modules through the serial port, customers can develop the Bluetooth functions and applications effectively. ID3 information display

BT-MC88-3X is a HCI communication Bluetooth module with APT-X function based on CSR8350 chip, which can support EDR to 3Mbits/s and BLE, and also compatible with Bluetooth 4.1. It provides a high-speed serial communication interface, digital audio interface and supports various protocols such as HFP, A2DP and AVRCP. It comes with a serpentine PCB antenna, which has passed the BQB certification of SIG and the EMC tests such as FCC, CE, IC and MIC to enhance your secondary developments and applications.

BT-MC88-12 is a low-cost HCI communication Bluetooth module based on CSR8811 chip, which can support EDR to 3Mbits/s and BLE, and also compatible with Bluetooth 4.2. It provides a high-speed serial communication interface, digital audio interface and supports various protocols such as HFP, A2DP and AVRCP. It comes with a serpentine PCB antenna, which has passed the BQB certification of SIG and the EMC tests such as FCC, CE, IC and MIC to enhance your secondary developments and applications.

BT-MC88-1X is a low-cost HCI communication Bluetooth module based on CSR8811 chip, which support EDR to 3Mbits/s and BLE, and also compatible with Bluetooth 4.0. It provides a high-speed serial communication interface, digital audio interface and supports various protocols such as HFP, A2DP and AVRCP. It comes with a serpentine PCB antenna, which has passed the BQB certification of SIG and the EMC tests such as FCC, CE, IC and MIC to enhance your secondary developments and applications.

The BT-MC57 series is designed with a high-end dual-mode single chip and built-in Bluetooth protocol stack, which supports Bluetooth 3.0 EDR and 4.0 BLE specifications, and also various protocols such as HFP, HSP, A2DP, AVRCP, SPP. It comes with CSR’s latest CVC auto-enhanced speech echo cancellation and noise reduction technology for HD hands-free calling and support Apt-x. With the use of the AT commands to control the module through the serial port, customers can develop the Bluetooth functions and applications effectively.

The BT-MQ33-1 module is designed with Qualcomm QCC300x chip, a stereo flash memory programmable solution which is fully certified by Bluetooth 5.0 certification and contains high cost performance. It supports single MIC cVc echo cancellation and hands-free noise reduction technology. With the use of the AT commands to control the module through the serial port, customers can develop the Bluetooth functions and applications effectively.

The BT-MQ38-1 module is designed with Qualcomm QCC300x chip, a stereo flash memory programmable solution which is fully certified by Bluetooth 5.0 certification and contains high cost performance. It supports single MIC cVc echo cancellation, hands-free noise reduction and Apt-x low-latency audio transmission technology. With the use of the AT commands to control the module through the serial port, customers can develop the Bluetooth functions and applications effectively.

BT-MC83-FY2 is a HCI module which is designed with a Cypress chip and meets the requirement of AEC-Q100. It supports EDR to 3Mbits/s and BLE, and also compatible with Bluetooth 4.0. It contains high-speed serial communication interface, digital audio interface and supports various protocols such as HFP, A2DP and AVRCP. With the use of the AT commands to control the module through the serial port, customers can develop the Bluetooth functions and applications effectively.

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