Metal copper-plating - Import export

DPC Ceramic Substrate Advantages: > In terms of shape processing, DPC ceramic substrate needs to be cut by laser, the traditional drilling and milling machine and punch machine can not be accurately processed, so the combination force and line width is also more fine. > The crystal performance of the metal is good; > The flatness is good; > The line is not easy to fall off; > The line position is more accurate, the line distance is smaller, reliable and stable, can be through the hole and other advantages.

hemical Composition: Total concentration of all impurities ≤ 65ppm (typical value ≤ 25ppm). Copper obtained by the difference between 100% and total impurities. ELEMENT SPECIFIED TYPICAL Se < 1.0 ppm < 1.0 ppm Te < 1.0 ppm < 0.5 ppm Bi < 0.5 ppm 0.20 ppm Sb < 1.0 ppm < 1.0 ppm As < 3.0 ppm 1.2 ppm Pb < 1.0 ppm 0.3 ppm Fe < 5.0 ppm 2.8 ppm S < 10.0 ppm 4.5 ppm Ni < 5.0 ppm < 1.0 ppm Sn < 1.0 ppm < 0.5 ppm Ag < 12.0 ppm 8.0 ppm

Copper coated, high strength low alloy steel wire Uniform copper coating Capable of welding poor base metals with presence of impurities Sufficiently high strength with sufficient low temperature toughness Radiographic weld quality free from porosity