Scanning electron microscopics - Import export

The application possibilities of the scanning electron microscope, SEM in combination with the energy dispersive X-ray microanalysis, EDX are manifold. The areas of application listed here are only examples of some of the applications. Many other questions can be clarified with our microtextural and microanalytical test methods. Our services for you: X-ray microanalysis, EDX element mappings, line scans, SEM imaging, particle size determination, fiber thickness measurement, damage assessment

The ZHN/SEM is a complete nanoindenter specifically designed for use in the confined spaces of the vacuum chamber of a scanning electron microscope (SEM).

Dedicated image enhancement, 3D reconstruction and metrology software for scanning electron microscopes (SEM) SEM image colorization made easy - Go from black and white to color effortlessly in just a few clicks. Superfast 3D reconstruction of surface topography in a matter of seconds - from SEM anaglyphs, two successive SEM scans at different tilt angles or four SEM images obtained by a 4 quadrant detector. 3D enhancement for single SEM images. Real-time 3D visualization at any zoom level or angle – SEM image overlays on 3D topography for enhanced rendering. SEM image enhancement and correction – automatic bi-colorization, colored 3D intensity maps, enhanced 3D rendering, configurable lighting and height amplification, gray level drift correction and denoising. Topography measurements - distances, step heights, areas, volumes, dimensioning of profile contours and cross-sections extracted from surfaces. Characterization of surface roughness and texture – advanced roughness/waviness filtering techniques – 2D and 3D parameters from Ra to ISO 25178. Advanced surface analysis of small objects, structures and features – morphology, grains and particle sizes and more. Correlative SEM studies – combine SEM images from different detectors (SE + BSE) – colocalize SEM images and 3D surface data from AFM/SPMs and overlay SEM images on 3D topography.

Applications: - Real-time A-scan & A-scan Capture - B-scan & SLICE - Threshold Mapping (post-processing) - Frequency Domain Imaging (FFT) - C-scan with Multi-gate SALI & SALI Groups - Cluster Analysis (post processing) - Advanced Time-of-Flight & Thickness Measurements - Scan Math Before and After Reflow Characterization - 3D Imaging - Void Gating (real-time) Available modes: - A-Scan - Patch Scan - Top Scan - Counterfeit Detection - B-Scan - Focus B - Sub B - Cross B - C-Scan - Dual Gate - SALI - SALI Groups - TX-Scan - Concurrent PE/TX - D-Scan - 3D

Early warning and forecasting of the deterioration of engineering materials operating in extreme conditions is a high priority activity within many industrial plants. The ability to perform diagnostics on a plant’s metal work without taking it offline is particularly of high value to industries in the energy, processing and other sectors. Currently diagnostic equipment is only able to discover deterioration in operational pipework and associated equipment after its condition has already reached a dangerous stage of degradation. SOLVER Pipe is a new highprecision and reliable diagnostic system that allows plant managers the ability to decrease risks and achieve incidentfree operation through anticipatory control and scheduled maintenance of materials and equipment within their industrial facilities.Advantage over electron microscopy compact, cheap and does not require complex vacuum technology.