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Atomizing - Import export

Service Provider

Germany

COM Express Mainboard (carrier board) Key functionalities For scalable platforms (from Intel Atom ® to Core ™ i7) Tested with many COM Express modules from different CPU module vendors. Applicable in Mini ITX systems Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany" Developed in the framework of Embedded Building Blocks Suitable for - Rapid Prototyping - Mass production in small, medium und large quantities

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Germany

COM Express™ Mini Module (Type 10) Key functionalities Intel® Atom TM E3800 ("Bay Trail-I") Up to 8 GB DDR3L with ECC support, soldered Optimized for ultra low power Extended temperature support Reach featured uEFI BIOS with easy-config, multi-setup and touch-support TQMx86 board-controller with customer specific expandability (flexiCFG) USB 3.0 device interface TPM 1.2 / 2.0 iRTC (highly accurate Industrial Real-Time-Clock) "Green ECO-Off" (minimum of standby power) Watchdog and thermal management Highest reliability, 24/7 certified Extra robust Design Formal coating capability COM Express™ Mini Type 10 (COM.0, R 2.1)

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Germany

Professional Tablet with Intel® Atom™ Z3745 Key functionalities Based on Intel® Atom™ QuadCore („BayTrail-T“) Full HD (1920x1200) display Capacitive multitouch with support for glove and passive pen Wireless features (WiFi, Bluetooth, GPS, 3G / 4G opt.) Audio and two cameras (8 MP / 2 MP) µSDXC card slot accessible by user S mart back-cover concept for implementation of additional hardware or industrial interfaces such as RS-232/485, CAN, Gigabit LAN, DeviceNet Docking connector with HDMI / USB 3.0 Removable battery, up to 12 hours working Wide temperature range: -10°C… +50°C Ruggedized / tested for IP65 Longevity (4 years)

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Germany

Modular Embedded PC’s with Intel® Atom™ E3800 Key Features Based on Intel ® Atom ™ E3800 („BayTrail“) Optimized for ultra low power Extended temperature High speed interfaces like Gigabit Ethernet, USB 3.0 and eSATAp DisplayPort and LVDS Extendable with 2x Mini PCIe incl. SIM Card socket Onboard eMMC and mSATA socket Integrated security features Audio with integrated amplifier Ultra compact design (10cm x 10 cm x 2,3 cm) Longevity support Also usable as embedded alternative for Intel ® NUC Standard boards (eNUC)

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Germany

Mehr als ein IPC! Schlüsseleigenschaften Robustes hochwertiges Gehäuse aus Aluminium "Made in Germany" Skalierbar von Intel Atom bis zu Intel Core i7 Passive optimierte Kühlung Langzeitverfügbarkeit Hohe Funktionssicherheit und Langlebigkeit (24/7) Über Riserkarte flexibel erweiterbar mit PCI/PCIe Gleichzeitiger Einsatz von 3 verschiedenen Speichermedien möglich Embedded Software-Lizenzen (Win XP, Win 7) Gehäuse optional mit internem Lüfter für kritische Temperaturbereiche (INNOVO IAP) Plattform für Industrial Virtualisation mit VMware ESXi (INNOVO IAP XL) Corporate Design in Farbe und Laserbeschriftung (INNOVO VARIO)

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France

Applications : - Air humidification - Dedusting - Cooling - Disinfecting treatments - Freshening treatments

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France

Applications : - Air-conditioning - Fabrics wetting - Spraying finishing of clothes - Paper wetting - Textile size

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Atomizing - Import export

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