Thermoplastics - Import export

Housing steel. Viewing glass thermoplastic polyamide. O-ring and flat seal rubber (NBR). Reflector aluminium. Screw and hex nut steel. Version: Housing painted black. Transparent viewing glass, high mechanical stability, non-ageing, temperature resistant with oil up to 100 °C, with water up to 70 °C. Reflector painted white, markings and scale black. Screw and hexagon nut, electro zinc-plated. Note: The oil level gauges can either be fastened as shown in the illustration or directly in the threaded hole. Centre distance for the fastening holes = L1 ±0.5. The oil level gauges are suitable for tanks operating without pressure. Maximum operating temperature: 100 °C.

Material, version: 1. Sealing cap red Polyamide 66 thermoplastic. 2. Filler sieve black Polypropylene thermoplastic. 3 Flange electro zinc-plated steel. 4. Fastening screws electro zinc-plated steel. 5 Flange seal cork. 6. Chain brass.

At OptiMel, you get everything from a single source to optimally use low pressure molding technology for high-quality electronics encapsulation. Thermoplastic hot melts are used as encapsulation material. Due to their range of properties, amorphous thermoplastic polyamide granules are predominantly used in low pressure molding. Thermoplastic polyolefins are also available for special applications, which are used whenever sufficient adhesion cannot be achieved with the preferred polyamides on the substrates used (e.g. cross-linked polyethylene). Due to different raw material combinations, the range of properties of these hot melt granules varies in terms of mechanical strength, operating temperatures and resistance to various media. The hot melt molding materials combine a viscosity spectrum that is favorable for the low-pressure process with a wide operating temperature range (-50 / + 150°C) and, in some cases, very good adhesive properties. Depending on the material

Sensitive electrical or electronic equipment, components and devices (ESD sensitive elements) may be damaged or destroyed by electrostatic discharges (ESD) in the immediate vicinity. Electrostatic discharges can come from people or through handling ESD sensitive components (e.g. during production, assembly, transport, storage etc). Electrically conductive products which conform to DIN EN 61340-5-1 are essential within electronic environments to prevent an electrostatic discharge. These products can be used for ESD applications or in ESD protection areas (EPA) in accordance with DIN EN 61340-5-1. Safety: These ESD products can also be used for devices, components and protection systems in areas with high risk of explosion. Use of these ESD products prevents the occurrence of electrostatic spark discharges, eliminating the potential ignition of gases and dusts which could lead to explosions in enclosed spaces.

Ball lock pins are used for easy fastening or joining of components or workpieces. The two balls are disengaged by pressing the push button and the pin can be slipped into holes in the workpieces. When the push button is released, the balls lock the connection securely. If required, the ball lock pins can be fitted with a retaining cable. Shear force double shear (F) = S · τ aB max. The values given for the shear force are the theoretical breaking load. These are non-binding reference values without consideration of safety factors and exclude any liability. The values given are for information purposes only and do not constitute a legally binding assurance of properties. The load values have been calculated in accordance with DIN 50141. Each user must determine individually whether the ball lock pin is suitable for the respective application. Different materials in which the ball lock pins are used, weather conditions and wear can influence the determined values.

Optimel is your reliable partner for solutions for encapsulating electrical and electronic assemblies. The innovative Low Pressure Moulding (LPM) technology offers optimal protection against external influences such as moisture, dust and vibrations, thus ensuring the longevity and reliability of your products. The Low Pressure Moulding process or hotmelt moulding process originated in the sealing of cable harnesses in the automotive industry - today it is used in many areas for the protection of electrical and electronic components. At 5-40 bar (in individual cases up to max. 60 bar), processing takes place at a much lower pressure than in the classic hotmelt injection moulding process. This makes it easy to directly encapsulate even sensitive components such as circuit boards, sensors, etc. The cycle times are limited to pure encapsulation