Results for

Agent Representative - Assembly of sub-assemblies

3 Companies

16 Products

DINOXSA

France

For 40 years DINOXSA & VISALP have rallied professionals to offer a very wide range of solutions and guarantee turnkey services, from one-off mechanical parts to highly complex mechanical sub-assemblies, the supply, storage and delivery of mechanical parts made by machining, striking, cutting, fabrication and other processes. DINOXSA VISALP will guide you through the development phase, by taking an active part in solving technical problems on your assemblies or sub-assemblies (aeronautical, renewable energy, wood, wind power, nuclear, heavy plant and industrial machinery, building and public works, agriculture, agrifood, arms, railways, sports, etc.). DINOXSA VISALP works alongside you at all stages coming up with proposals: process validation, prototype co-validation. Ninety percent of the production covers: CW, AW, stainless steels, POM, PTFE, marble, pyrex, wood, etc. from 200 to 500 000 parts p.a.
PENKO ENGINEERING

Netherlands

PENKO Engineering B.V. develops, manufactures, commissions and supplies complete weight controlling panels as well as a wide range of instrumentation and controllers designed for high speed/high accuracy weighing and dosing applications. Our product range includes a variety of ancillary products including loading assemblies, amplifiers, display panels and software for data capture and display. Our expertise lies in the design and manufacturing of complete or sub-assembly units for OEMs and/or ‘one-off’ projects.To our customers we are most valued for solving project based challenging weighing solutions and our commitment to services excellence. Standard software allows for an "out-of-the-box" implementation for check weighing, mono-filling and belt-weighing solutions. Customer Loss-in-weight solutions are built to specifications.PENKO is your total service provider for process control with expertise in industrial weighing and dosing solutions. Easily integrated into PLC systems.
STANDARD SYSTEMS

South Korea

We are a " IC Packaging Service" provider for IC design and fabless companies. We use good sub- contractors in Korea and other Asia area for IC assembly into various package types with extensive experience. Linked sub-contractors are located mostly in Korea, Thailand, and China.., etcProvide IC packaging services to assemble die in wafer form to various package types: BGA, QFP, SO, QFN, TSOP, PDIP...., And We wish to work for Fabless and IC Design companies.Semicondcutor Assembly Services to package die in wafer form, and Packages: BGA, QFP, SO, TSOP, QFN, PLCC, PDIP....etc We can supply Molded Dummy QFN strips for saw blade test(QFN strips with mold encapsulation). The unit sizes are available for various sizes from 2 mm SQ. Most of package types are available; SiP, Stack-CSP, SoC, BGA, QFP, QFN/MLF, SO, DIP.., etc. You can use good qualified semiconductor(ICs, Discrete)assembly OEMs through our company. We will serve you all your inquiry and request.Thanks, Standard Systems

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Agent Representative - Assembly of sub-assemblies

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3 Companies