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Layered%20board - Taiwan R.O.C.

Taiwan R.O.C.
2 Companies 19 Products

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  1. ILEDM PHOTOELECTRONICS INC.

    Taiwan R.O.C.

    iLEDm Photoelectronic, Inc, formed in 2006, is the leading LED manufacturer that develops COB (Chip On Board) light engine. iLEDm held various Intelligent Patent (IP) on formulae and structures of manufacturing COB LED. Core Technology iLEDm develops high quality COB (Chip On Board) flat surface light engine packaged on aluminium or copper board, which improves heat conductivity, lowers light decay and improves light efficiency. Most importantly the advanced packaging technology of iLEDm does not have the need of a frame of any kind on the luminous body, this new packaging technology not only reduces the material cost and thermal resistance, it also improves the product capacity and the beam angle. The multichip packaging technology has a luminosity of 100 Lumen/Watt, CRI(Ra) of 85 and uniformity of light distribution. The COB light engine has no need of a secondary optical, which excluded the cost on diffusion layer design; this also ensures no multi image ghosting.

  2. HAO MING TECHNOLOGY CO.,LTD.

    Taiwan R.O.C.

    Our main products: Rigid Printed Circuit Board, HDI, Aluminum Based Board, Copper Clard Board.Main Spec as below: 1. Base material: FR1~5, HI-TG, Halogen Free, ISOLA, CEM, Aluminum/Copper2. Layers: 1~20 layers3. Min Trace/Space: 3/3 mil4. Min Via hole: 6 mil (0.1524mm)5. Min SMD Pitch: 8 mil (0.2032mm)6. Max Panel Size: 21"*24"7. Finished Thickness: 8~126 mil (0.2032~3.2004mm)8. Finished Copper: 1/3~5OZ9. L/layers REG Tolerance: 3 mil(0.0762 mm ) 10. Solder Mask Reg Tolerance: 2 mil(0.0508 mm ) 11. Finish: OSP, HASL, Lead-free HASL, immersion gold , immersion silver, Immersion tin, Electrolytic Gold, Gold Edge, Carbon Ink, Peelable Mask12. Routing Tolerance: 4 mil(0.1016 mm ) 13. Board Flatness Tolerance: ± 0.7%14. Impedance control: Depend on the customer's requirement ±10% 15. Blind and Buried Vias

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