Printed circuit soldering - Import export

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and spring-loaded sockets for reliable contact. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and • spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple material and spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Reflow Soldering Oven JUKI’s RS 800 8 zone reflow soldering oven embodies the best compromise between cost and effectiveness, floor space and energy consumption. With its 8 zones even complex soldering profiles can be constructed. 2 cooling zones ensure a suitable cooling down of the printed circuit boards after the soldering process.

SELECTIO Selective soldering systems for automatic single point soldering and multiple point soldering It is not always possible to use mass soldering processes such as wave soldering to perform a certain soldering task. Individual soldering steps are often necessary. To automate this process and to lower the costs while maintaining the high quality requirements, STRECKFUSS SYSTEMS has developed the selective soldering system SELECTIO. Just like our wave soldering system TITANIUM, SELECTIO too is equipped with the corrosion and tin resistant agent titanium and therefore works perfectly for lead free soldering. Product characteristics – an overview: x/y/z- axes system with precision toothed drive belt transport system and assembly carrier standard stand- alone- system (offline system): optional transportation belt connection as inline system printed circuit board transportation with assembly carrier soldering processes: single point nozzle and surface nozzle as well as dip soldering via mask technique fluxing out of vendor's flux container with multi- drop- fluxer nozzle short wave IR- quartz- radiators for preheating of printed circuit boards pyrometer for contact- free temperature check of printed circuit boards easily exchangeable soldering nozzles Microsoft© Windows user surface and process visualization: - BDE for documentation complying with DIN ISO 9000 ff - management data organization - optional real- time video surveillance

Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service