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Printed circuits - Import export

China

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Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Poland

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PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.

Spain

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Designed to meet the needs of smaller, high performance electronic circuitry. These new gap fillers provide an outstanding heat transfer interface across a range of component heights with minimal compression force. THESE PRODUCTS ALL PROVIDE: • Range of thicknesses from 20 mils to 250 mils • Intrinsically tacky surfaces for excellent self-adhesion • Available with various surfaces (no-stick, fabric) for specific application needs • UL 94 V-0 flame retardancy • Large 24" x 24" sheet sizes for improved die-cutting yield with custom sizes available • Range of compliance and thermal conductivities to fit specific applications

Germany

Base Material: Dielectric with thermal conductivity up to 8 W/mK Halogen free Construction made of IMS material or kit Metal plate of Al (standard AL5052 others on request) Copper: 18 - 140 µm Final Finish: LF HAL, ENIG, OSP Solder Resist: High reflex rate (with) for LED application on request 80% Final Thickness: Singel layer copper with Al 0,25-3 mm Double-layer copper with 0,6 - 3 mm Metal core 0,6 - 3 mm

Germany

Base Material: Flexible material: Polymide 25 µm (+ adhesive) (adhesiveless on request) Rigid material FR4 Copper: 18 µm min. starting foil, Higher thickness on request Final Finish: Enig, iSn, OSP, electrolytic Ni/Au Solder Resist: Cover layer Polimide 25 µm (+ adhesive) + LPISM Final Thickness: max. 1,6mm UL approved for special constructions need to be checked

Germany

Base Material: Flexible material: Polymide 25 µm (+ adhesive) (adhesiveless on request) Polyester material / avaiability to be checked Copper: 12 µm min. starting foil, Copper foil type RA, ED Final Finish: Enig, iSn, OSP, electrolytic Ni/Au Solder Resist: Cover layer Polimide 25 µm (+ adhesive) Flexible S/M Stiffener Material: Polyimide, FR4, Al-plate (1,0mm, 1,6mm) Cu-plate (thickness to be checked) Adhesives: 3M materials (standard) Outline: Punching, laser Specials: Bare back, Split flex, Sculptured, flex, Shielding flex foils

Germany

Chip on board (COB) is the method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases chip on board construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads.

United Kingdom

Blue Chip Technology have an in-house team of dedicated engineers with a wealth of expertise and experience in designing boards for a variety of applications and industries. We excel in compact PCB designs that allow you to incorporate the necessary features into your product.

Belgium

Ceramic prined circuit board feature many advantages over metal core and FR4 circuit boards as they combine excellent thermal characteristics with low a expansion. They are also suitable for multilayer applications, show lower deformation, warpage and operate under higher temperatures. Elite advanced technologies is your partner for ceramic substrates and circuit boards. Thanks to our large laser facilities and patented printing technology we are able to accomodate both very tight tolerances as well as high volume production at a high quality.

Belgium

LTCC (Low Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave performance characteristics. Thanks to its low sintering temperature (around 900°C) allows it to co-fire with highly conductive metals such as silver and gold. It is sometimes referred to as “glass ceramics” because glass is mixed in its main raw material, alumina. Elite Advanced Technologies is one of the few LTCC specialists globally that is producing its own green tape (base material low temperature co-fired ceramics). LTCC is best suited for applications that can take advantage of one or more of the following: Good electrical performance Dimensional and electrical stability under temperature, moisture and mechanical stress 3D capability curved, cavities, channels Effective thermal management with metal loaded vias (>100 W/MK) Hermeticity Matched TCE with semiconductors (Thermal Coefficient of Expansion) Multiple assembly and packaging solutions

Belgium

When you are looking for substrates for electronic circuits with a high thermal conductivity and a low expansion coefficient (CTE), ceramic pcb will be your preferred choice of material. Today ceramics are already widely used as substrates in many microelectronic components and power LED packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are Chip-on-board (COB) modules, High power circuits, proximity sensors, battery drivers for EVs, … .

China

SCSPCBA was established in 2016 under the SUCCESS GROUP, a worldwide total-factor PCBA intelligent manufacturing factory, which has precipitated an experienced core management team of PCBA processing and manufacturing and component BOM supply chain. serving many domestic and foreign customers in various industries such as automotive electronics, medical electronics, new energy, industrial control and security. Based on one-stop service, SCSPCBA provides four major services: PCB manufacturing, BOM components procurement and SMT/DIP assembly and Box-build. and EMS value-added services such as ODM for IoT and medical devices.

China

SCSPCBA was established in 2016 under the SUCCESS GROUP, a worldwide total-factor PCBA intelligent manufacturing factory, which has precipitated an experienced core management team of PCBA processing and manufacturing and component BOM supply chain. serving many domestic and foreign customers in various industries such as automotive electronics, medical electronics, new energy, industrial control and security. Based on one-stop service, SCSPCBA provides four major services: PCB manufacturing, BOM components procurement and SMT/DIP assembly and Box-build. and EMS value-added services such as ODM for IoT and medical devices.

China

SCSPCBA was established in 2016 under the SUCCESS GROUP, a worldwide total-factor PCBA intelligent manufacturing factory, which has precipitated an experienced core management team of PCBA processing and manufacturing and component BOM supply chain. serving many domestic and foreign customers in various industries such as automotive electronics, medical electronics, new energy, industrial control and security. Based on one-stop service, SCSPCBA provides four major services: PCB manufacturing, BOM components procurement and SMT/DIP assembly and Box-build. and EMS value-added services such as ODM for IoT and medical devices.

United Kingdom

We can make, test and despatch conventional and double-sided plated through hole (PTH) printed circuit boards within 48 hours of receipt of manufacturing data. Provided we receive the data early enough on day one.

Ukraine

We carry out a full cycle of development of electronic devices: supply of electronic components, stencils and printed circuit boards, design of electronics, redesign of finished devices. Applying the principles of lean production, we achieve a price reduction while maintaining a high quality of services. Due to quality control at all stages of production, we have the reject rate less than 0.5% (at observance of all requirements to the order). Operative daily planning allows us to achieve maximum efficiency in the use of working time. Thanks to that, in the presence of all the equipment in the warehouse, we can take the order to work during the day from the moment of order. We have our own high-tech equipment, and offering good quality with competitive assembly cost.

China

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Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

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Switzerland

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IST AG's smallest platinum temperature sensor operates within a temperature range of -50 °C to +150 °C (according to DIN EN 60751) and is designed for automatic placement in high volume applications on printed circuit boards where long-term stability, interchangeability, combined with low cost are important. This RTD is typically used in energy management for thermal compensation, industrial and medical devices. It features a very small size of 0.75 mm x 0.75 mm with very low drift and can be integrated within semiconductor devices. It is also designed for Au-wire-bonding. Customized adaptations are available on request.

China

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Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month

Germany

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Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and • spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Germany

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Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple material and spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Germany

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Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and spring-loaded sockets for reliable contact. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Germany

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Optometer module. Feature: The X1 optometer is available as a printed circuit board either with or without a housing and is suited for applications that do not require a keyboard or display. Four signal inputs enable connection with all measuring heads from Gigahertz-Optik.

Germany

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Optometer module. Feature: The X1 optometer is available as a printed circuit board either with or without a housing and is suited for applications that do not require a keyboard or display. Four signal inputs enable connection with all measuring heads from Gigahertz-Optik.

Germany

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SELECTIO Selective soldering systems for automatic single point soldering and multiple point soldering It is not always possible to use mass soldering processes such as wave soldering to perform a certain soldering task. Individual soldering steps are often necessary. To automate this process and to lower the costs while maintaining the high quality requirements, STRECKFUSS SYSTEMS has developed the selective soldering system SELECTIO. Just like our wave soldering system TITANIUM, SELECTIO too is equipped with the corrosion and tin resistant agent titanium and therefore works perfectly for lead free soldering. Product characteristics – an overview: x/y/z- axes system with precision toothed drive belt transport system and assembly carrier standard stand- alone- system (offline system): optional transportation belt connection as inline system printed circuit board transportation with assembly carrier soldering processes: single point nozzle and surface nozzle as well as dip soldering via mask technique fluxing out of vendor's flux container with multi- drop- fluxer nozzle short wave IR- quartz- radiators for preheating of printed circuit boards pyrometer for contact- free temperature check of printed circuit boards easily exchangeable soldering nozzles Microsoft© Windows user surface and process visualization: - BDE for documentation complying with DIN ISO 9000 ff - management data organization - optional real- time video surveillance

Austria

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CONTAVAL® 2017 is a laminate consisting of E-glass fabric, graphite and epoxy-resin and is used e. g. as a conductive slot filler in machines and also as soldering bath carriers for printed circuits. CONTAVAL® 2017 has excellent mechanical properties and shows conductivity parallel and perpendicular to the layers as well as high chemical and temperature resistance.

Germany

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Aluminum composite foil bags, also known as aluminum vacuum bags, are produced in our production from highquality raw materials on fully automatic production lines and are characterized by the following properties Antistatic Waterproof Electrostatic shield Heat sealable The size of the bags is not fixed by default but rather can be implemented individually for our customers also as a 3in1 solution including tailormade desiccant and moisture indicator. Style and size are variable, such as flat bags, 3D bags, etc. The production takes place in strict accordance with the standards GB / T 10371988, GB / T 10382000, MILB81705C. Packaging of electronic components Packaging of printed circuit boards (PCB Packaging of integrated circuits (IC) Packaging of hard drives

Germany

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TYP C 044/S Cutting, stamping and bending device for axial components Description To facilitate the placement of short axial leaded components that must be cut before insertion into the circuit board to the appropriate length and bent to the required height and - if necessary - marked . This axial taped components are processed in high- components. In the device 044 C / S to be bent, the components are manually inserted into the device and processed by triggering the pneumatic foot switch. The high- axial component can be provided either at one or at both terminal wires with a bead for preventing falling out of the printed circuit board according to the manual setting operation. Components

Russia

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SDB (Sovtest Dry Box) series dry storage cabinets manufactured by Sovtest ATE provide storage and moisture protection for a wide range of moisture sensitive components including integrated circuits, semiconductors, printed circuit boards, LEDs & LDs, precision metal parts, optical equipment, laboratory samples, etc. The cabinets maintain internal humidity range of 1-50%RH (tolerance ±1%). Humidity and temperature are controlled by the integrated high-precision sensor with digital interface. All SDB Series cabinets are completely ESD-safe in compliance with IEC 61340-5-1 regulations. All metal elements are coated with electrostatic paint and grounded.