Printed circuits - Import export

Designed to meet the needs of smaller, high performance electronic circuitry. These new gap fillers provide an outstanding heat transfer interface across a range of component heights with minimal compression force. THESE PRODUCTS ALL PROVIDE: • Range of thicknesses from 20 mils to 250 mils • Intrinsically tacky surfaces for excellent self-adhesion • Available with various surfaces (no-stick, fabric) for specific application needs • UL 94 V-0 flame retardancy • Large 24" x 24" sheet sizes for improved die-cutting yield with custom sizes available • Range of compliance and thermal conductivities to fit specific applications

BASED ON POLYIMIDE FILM COATED WITH A SPECIAL SURFACE CONDUCTIVE ADHESIVE. STATIC GENERATION DURING ROLL UNWIND AND TAPE APPLICATION IS ELIMINATED. IT CAN WITHSTAND WAVE SOLDER TEMPERATURES UP TO 300C AND LEAVES NO ADHESIVE RESIDUE ON PRINTED CIRCUIT BOARDS UPON REMOVAL.