The T3 system combines smooth operation, low noise, simple assembly, and economy. The side bands, which snap together, replace a conventional pin and bore connection and prevent relative movements between the joints giving extremely low wear. This means virtually no wear or abrasion (cleanroom). The t-band's geometry means that hardly any polygon effect is generated when the energy chain is placed. The t-band therefore rolls in a very smooth arc, giving extremely low vibration and noise. In order to reduce the manufacturing and installation costs, the t-band is not mounted individually, but – much like the E3 system – in an eight-link length. Due to its low mass, the t-band is suitable for applications with low fill weights and short strokes combined with high speeds and accelerations.
Aside from the tried-and-tested uses of the E6, the new generation offers additional advantages which significantly simplify operation. In addition, design changes have improved accessibility to the interior, reduced weight and made assembly easier.
- Option without camber (NC) simply by turning the inner link
- Extremely quiet due to the small pitch and "brake" in the stop-dog system
- (E61.29.070.055.0 at 1m/s = 32dB(A) according to igus internal test 4479)
- Extremly low vibration
- Low-abrasion connector system (no bolts and holes necessary)
- Virtually no polygon effect, thereby "smooth rolling" operation
- Smooth interior design for a long lifetime for cables and hoses
- E61.29 series: cross bars on both sides can be snapped open and removed along the inner and outer radii
- Weight savings approx. 30% compared to the E6 system
Product model :X-7600
Detection accuracy :5um
The use of the world's top HAMAMATSU Japan X-ray source can easily identify the semiconductor packaging gold wire bending gold wire fracture, large load table, can be placed in a large industrial control board ultra-long LED light bar applicable to various fields of electronic products
The LATTICE LC5512MV-45QN208C is a Complex Programmable Logic Device (CPLD) that is designed to provide high-performance, low-power, and low-cost solutions for a wide range of applications. It is a 4.5ns, 275 MHz CPLD with a surface mount package and a temperature range of 0°C to 90°C (TJ). The device is packaged in a 208-PQFP (28x28) tray and is in-system programmable using the ispXPLD® 5000MV.
The NCV8452STT1G Motor Driver and Controller is a single output device specifically designed for automotive and AEC-Q100 compliant applications. This NMOS technology device has a surface mount mounting style and is built with a small footprint. It is designed to work with a voltage load between 5 V ~ 34 V, and its output current is rated to be 1 A. Features: - AEC-Q100 compliant - NMOS technology device - Surface mount mounting style - Operating temperature range of - 40 C - Unit weight of 0.006632 oz - Output current of 1 A - Maximum Voltage Load of 5 V ~ 34 V Applications: The NCV8452STT1G Motor Driver and Controller is ideal for general purpose applications including automotive, as it has the rated temperature range and current. It is also designed to work with a wide voltage range of 5V-34V and is AEC-Q100 compliant.
The AZ10/100LVEL16VS is a differential receiver with variable output swing. The LVEL16VS has functionality and output transition times similar to the EL16, with an input that controls the amplitude of the Q/Q¯ outputs. FEATURES • 250ps Propagation Delay • High Bandwidth Output Transitions • Operating Range of 3.0V to 5.5V • Internal Input Pulldown Resistors • Functionally Equivalent to ON Semiconductor MC10EL16, MC100EL16 & MC100LVEL16 • Variable Output Swing
The 74HC175PW,118 NXP Semiconductors Integrated Circuits (ICs) Flip-Flop is a D-Type flip-flop with a voltage-supply of 2 V ~ 6 V and an operating-temperature of -40°C ~ 125°C (TA). It has a single element and a current-output-high-low of 5.2mA, 5.2mA. It is packaged in a Tape & Reel (TR) Alternate Packaging and has a frequency-clock of 89MHz. It has a surface mount mounting-type and a max-propagation-delay-v-max-cl of 30ns @ 6V, 50pFFeatures: • Voltage-supply of 2 V ~ 6 V • Operating-temperature of -40°C ~ 125°C (TA) • Single element • Current-output-high-low of 5.2mA, 5.2mA • Packaged in a Tape & Reel (TR) Alternate Packaging • Frequency-clock of 89MHz • Surface mount mounting-type • Max-propagation-delay-v-max-cl of 30ns @ 6V, 50pF Applications: • Automotive • Industrial • Consumer • Medical • Telecommunications
1.5 A, Adjustable Output, Negative Voltage Regulator The LM337 is an adjustable 3−terminal negative voltage regulator capable of supplying in excess of 1.5 A over an output voltage range of −1.2 V to − 37 V. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow−out proof. The LM337 serves a wide variety of applications including local, on card regulation. This device can also be used to make a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the LM337 can be used as a precision current regulator. Features •Output Current in Excess of 1.5 A •Output Adjustable between −1.2 V and −37 V •Internal Thermal Overload Protection •Internal Short Circuit Current Limiting Constant with Temperature •Output Transistor Safe−Area Compensation
Spare parts include for example chambers, filaments, arc slits, holders and many other parts. The pare parts are made of graphite, molybdenum, tungsten and alloys. They are extremely durable and long lasting and therefore save money and maintenance time.
100 or more Plansee components are at work in every beam path. They ensure that the ions are generated efficiently and guided precisely and free from impurities along the beam path to the wafer. For customers in the semiconductor industry, Plansee spare parts are increasingly becoming more than just spares. Taking the equipment manufacturer's original spare parts as starting point, Plansee optimizes the geometries and material compositions. The benefits to you:
— Simplified component installation and removal
— Longer service lives
— Lower cleaning costs
— Reduced maintenance work
— Reduced downtimes
Rohm Semiconductor SML-E12M8WT86 is available at WIN SOURCE. Please review product page below for detailed information, including SML-E12M8WT86 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SML-E12M8WT86 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.
Rohm Semiconductor SML-A12MTT86 is available at WIN SOURCE. Please review product page below for detailed information, including SML-A12MTT86 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SML-A12MTT86 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.
With its complete array of material and process competencies, NKCG serves all types of semiconductor applications. NKCG has been a reliable partner for semiconductor material producers and device makers for decades, bringing its vast experience to improve processes.
MaxTC Power+ was designed with high power and flexibility in mind, allowing for customization to suit different package and interface variations. The system allows for forcing temperature across a wide range of high power device sizes and types, whether socketed or soldered to board. With state of the art design and technology the Max TC Power Plus unit stimulates DUT to the desired temperature precisely and consistency by direct contact with a powerful thermal head.
Powerful stand-alone Thermal control unit features:
o Cooling Power -40°C@400W (steady state)
o Ramp Rate up to 120°C/Min
o Temperature stability: ±0.5°C
o Temperature Range -75⁰C to 200⁰C
o Minor temperature overshooting at high power spikes
o Fast recovery time at high power spikes
o Replace LN2, Thermostream, Chillers and Chambers
o Remote controlled
MaxTC Power+ is a stand-alone, plug&play unit, requires only:
o AC Input; MaxTC: 208-240 VAC; 1~ 50Hz /60Hz 20A
o Plug Type: NEMA L6-20 or 30 o
FlexTC Thermal Forcing System stimulates DUT to the desired temperature by direct contact/conduction between a thermal head’s plunger and the DUT. Soldered down or socketed DUT’s are accessed through a selection of interfaces such as adapter plates, boom stands, vacuum and pneumatic systems. .
Powerful stand-alone Thermal control unit, Features:
o Greatest cooling power 21W@-40⁰C
o Extended temperature range enable to reach easily -40⁰C or less at Tj
o Fastest time to temperature ratio
o Very short stabilize soak time
o Excellent temp. stability 0.2⁰C
o Operated by a smart controller which is accessed through a 7” color touch-screen with extensive menu
o Can be remotely controlled via an Ethernet
Flex TC System suits your device test at:
o Your test bench o ATE in your lab. & can be seamlessly integrated in production with handlers and ATE’s
o MaxTC can also be used to test multi-site DUT’s
o Also as a thermal chuck with probe station
Mechanical Devices is pleased to offer its customers with the first direct phase change TCU with DUAL head. Each head can be controlled individually. This DUAL head unit makes it possible to reduce the cost per workstation, saves space, reduces power consumption and heat emission in the laboratory or production hall.
Temp. range: -30°C to 200°C
Reduced cost per workstation
Fully programmable for automation
Fits 19″ rack cabinet
Perfect for QSFP, QSFP-DD..
The TP platform system is a breakthrough product that introduced the use of refrigerant for active cooling &
heating of components with no need of chiller, CDA, or consumable refrigerants such as liquid nitrogen and
liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and
mechanical performance with a temperature ranging from -60 to 220°C. Each system contains a thermal
chuck and a self-contained thermal control unit.
* Temperature range of -60°C to +220°C,
* No LN2 or CO2 required
* No chiller or CDA required
* Temperature stability +/-0.1
* Fully programmable for automation
* Quite & portable
* Maintenance FREE
The new model of Confidex Steelwave Micro II is equipped with last generation M780 chip by Impinj, with better sensitivity and an EPC memory of 496 bit. This tag is resistant, IP67, convenient, and can be applied on metal surfaces too.
PSL manufacture every type and size of heat sink - including standard extrusion, bonded-fin and liquid cooling plate. We can incorporate fans and embedded pipes, and we provide a full stack assembly service using any type of semiconductor device. Full 3D CAD drawings, thermal simulation graphics, pressure testing, technical advice and consultancy.
Prototypes available, volume quantities provided by fixed schedules.
Aluminium CNC milling part in black anodize finish
Tolerance:+/-0.05mm， Critical holes and threads
CNC Machining parts, Machining in Aluminium stainless steel,brass,copper, titanium,POM and so on. Aluminium housing, Blocks, flanges, valve seat, supporter
CNC Turning parts ,Machining in Aluminium stainless steel,brass,copper, titanium,POM and so on.
Germanium wafers are a semiconductor material & therefore are a smart choice for microelectronics. Due to its unique electric properties, it is widely used for sensors, solar cells and infrared optical applications.
The wafers are also great for microelectronics as the space is limited and being available in 500μm or less it makes it perfect to achieve the high quality results required. It’s thermal conductivity makes it a good alternative to silicon.
Our stock wafers are produced as thin as 500μm and provide exceptional surface quality. However, we can manufacture to a fully customised specification with a wafer thickness as little as 10 μm. Typical specifications of our germanium wafers are:
10mm – 150mm in diameter
<500μm in thickness
Doped and undoped Germanium
Excellent performance with porous vacuum componets
Manufacturers around the world trust our porous materials to deliver excellent performance when used as vacuum components. Anti-static additives can also be introduced for applications that require conductivity.
Ensure purity–Material is backed by the Certified Pure POREX™ program of independent laboratory testing of leachables, extractables and interfering substances.
Deliver precise flow rates and tolerances–Engineered for tight pore size and volume control.
Improve device effectiveness–Design is customizable per application and can incorporate anti-static properties.
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