Description

DIL-Labcard Epoxy fibre-glass 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-Leadfree) 14 x 14 soldering pads 2.00 x 2.00 mm Hole spacing 2.54 x 2.54 mm Hole diameter 1.00 mm Size 40.00 x 40.50 mm

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