RE01-LF

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Surface with solder stop mask Hole spacing 2.00 x 2.00 mm 44 x 42 soldering pads 1.60 x 1.60 mm Hole diameter 1.00 mm Working temperature max. 150 °C Soldering bath proof: 260 °C > 50 sec. Size 90.17 x 95.89 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm