RE120-LF

Prototyping Boards Dual Inline

Description

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.50 x 2.50 mm 37 x 58 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Connector 31-channel DIN 41617 Size 100 x 160 mm

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